Job Description: Seeking an innovative individual to take on Packaging integration and process development role for a variety of projects including SoC. Job Responsibilities: Responsible leading packaging assembly technology development. Work with cross functional team and lead SoC Package integration and architecture efforts. Work with foundry and OSAT to bring packaging solution from concept to HVM. Drive industry with advanced Package solutions, new material development, and specs. Job Requirements: Excellent engineering problem solving with strong physics and fundamentals. Expert in packaging assembly processes including SMT, die prep, die attach, flip chip, underfilling, wire bonding, molding, singulation and back-end processes. Working knowledge in memory device architecture, design, test, etc. Familiar with package design software, APD, etc. Ability to work independently and take on projects with minimum supervision. Strong program management skills Expert in materials characterization and analysis, DOE, reliability standards and FA techniques. 5+ years experience in Semiconductor Packaging Process, Design and Material development. Excellent communication skills that can enable the candidate to work well with internal cross functional teams and overseas suppliers. Job Details: Company: Apple Vacancy Type: Full Time Job Location: Santa Maria, CA, US Application Deadline: N/A Apply Here vacancyoptions.com
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